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Personal fluoride and solvent exposures, and their determinants, in semiconductor manufacturing.
Woskie SR; Hammond SK; Hines CJ; Hallock MF; Kenyon E; Schenker MB
Appl Occup Environ Hyg 2000 Apr; 15(4):354-361
Personal air sampling for fluorides and solvents was done at 35 semiconductor fabrication facilities in the United States. Fluoride compounds were used in etching and cleaning operations, and solvents were used in photoresist and developing operations. All personal solvent and fluoride levels were less than 2 percent of current Occupational Safety and Health Administration (OSHA) standards. Statistical models of the exposure determinants for the target agents found production level, as indicated by number of semiconductor wafer cassettes loaded/unloaded from the target machines or baths, was predictive of fluoride, xylene and 1-methoxy-2-propyl acetate exposures. The percent of fresh air ventilation and the percent of xylene in the photoresist were also significant determinants in the statistical model predicting personal xylene exposure levels.
Air sampling; Fluorides; Solvents; Cleaning compounds; Statistical analysis; Models; Air samples; Xylenes; Exposure levels; Exposure assessment; Ventilation; Semiconductors; Chemical analysis; Glycols; Fluoride compounds; Exposure limits; Air sampling; Air quality; Air purification; Author Keywords: Semiconductor Manufacturing; Chemical Exposures; Glycol Ethers; Fluoride; Solvents; Exposure Assessment; Exposure Determinants
Cooperative Agreement; Agriculture
Issue of Publication
Applied Occupational and Environmental Hygiene
OH; MA; CA
University of California - Davis
Page last reviewed: June 15, 2021
Content source: National Institute for Occupational Safety and Health Education and Information Division