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Electrochemical study of SiC particle occlusion during nickel electrodeposition.
J Electrochem Soc 1993 Aug; 140(8):2235-2237
Previous, published work conducted by the Bureau of Mines showed that chromium particle occlusion occurs as a result of particle collisions with the cathode surface. Conductive chromium particles within the electric field were also shown to cause a local rise in the cathodic current density on the area immediately adjacent to that particle. In order to research the effect of conductive particles vs. semiconductive particles on the occlusion process, nickel electrodeposition was studied in the presence of SiC particles and compared to previous studies on nickel electrodeposition in the presence and absence of Cr particles. The effect of semiconductive SiC particles on nickel electrodeposition was to catalyze the formation of H as well as Ni+ intermediates.
Electrochemical-analysis; Electrochemical-properties; Electrochemical-reactions; Metal-compounds; Metal-dusts; Metallic-compounds; Metallic-dusts; Metallic-ions; Mining-industry; Mineral-processing; Metals; Author Keywords: electrodeposition; electrodeposits; nickel; catalysis; catalysts; particle size; electric impedance; Nyquist diagrams
Issue of Publication
Journal of the Electrochemical Society
Page last reviewed: September 2, 2020
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