Measuring electrodeposit adhesion.
Cramer-SD; Cammarota-VA Jr.; Schlain-D
Met Finish 1970 Mar; 68:3-8
The Bureau of Mines developed a new test for measuring the adhesion of nickel electrodeposits on copper substrates. The proposed test involves brazing the free surface of the deposit to a steel rod with silver solder, machining this specimen to a desired shape, and then measuring the strength of the deposit-substrate bond by the application of a tensile load.
OP; Journal Article
Metal Finishing; Preparation, Electroplating, Coating