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Grain growth in thin aluminum-4% copper alloy films.
Thin Solid Films 1975 Nov; 30(1):137-143
Aluminum-4 wt-pct copper alloy films were prepared by vapor deposition and examined for grain growth in the temperature range 400 deg to 500 deg c. The results show that growth occurs in accordance with the empirical equation d = (kt)n. The term n, with a value of 0.18, Was found to be independent of temperature. A discrete activation energy of 30 kcal/mole was calculated for the process. The observed growth kinetics were compared with those observed for pure bulk aluminum. The observed grain size was independent of film thickness.
OP; Journal Article
Issue of Publication
Thin Solid Films
Page last reviewed: March 11, 2019
Content source: National Institute for Occupational Safety and Health Education and Information Division