Aluminum-4 wt-pct copper alloy films were prepared by vapor deposition and examined for grain growth in the temperature range 400 deg to 500 deg c. The results show that growth occurs in accordance with the empirical equation d = (kt)n. The term n, with a value of 0.18, Was found to be independent of temperature. A discrete activation energy of 30 kcal/mole was calculated for the process. The observed growth kinetics were compared with those observed for pure bulk aluminum. The observed grain size was independent of film thickness.
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