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Surface tension and density of liquid tin-lead solder alloys.
Schwaneke AE; Falke WL; Miller VR
J Chem Eng Data 1978 Jan; 23(4):298-301
As part of the Bureau of Mines program to either conserve scarce domestic mineral resources or substitute for them, development of new soldering systems was undertaken. To support and facilitate this study, the properties of tin-lead solders were investigated. Surface tensions and densities of tin-lead solder alloys have been determined by use of an improved maximum-bubble-pressure system that includes provisions for density measurements. Results show general agreement with accepted theories for simple solutions. Comparisons with other reported measurements of these alloys are made.
OP; Journal Article
Issue of Publication
Journal of Chemical and Engineering Data
Page last reviewed: December 17, 2021
Content source: National Institute for Occupational Safety and Health Education and Information Division