A nondestructive procedure for measuring electrodeposit porosity has been developed which records the location and number of deposit defects including pores, pits, and voids. The procedure involves the passage of an x-ray beam through the deposit-substrate system onto suitable film. The defects are recorded as images on the film. Variables studied included intensity and spectra of the x-ray beam, composition and thickness of deposit and substrate, film type and developing procedure, and limits for detecting defects. At an x-ray tube voltage of 40-kv, pores several mils thick were easily detected in copper-nickel specimens more than 20 mils thick. To illustrate the utility of the procedure, the effect of substrate oxidation and of current density on electrodeposit porosity was briefly studied.