A kinetic investigation of copper cementation in a revolving drum was undertaken by the Bureau of Mines to explore the effects of a porous copper deposit attached to the iron surface and a fluidized slurry of copper particles surrounding the iron precipitant. The rate of cementation was found to be significantly enhanced by the increased cathodic areas provided by a porous copper deposit or the presence of a fluidized bed of copper particles contacting the iron precipitant. The cementation rate was found to be retarded by increased ionic strength, low ph, and the presence of oxygen. The cementation reaction was first order with respect to precipitant surface area. Copper cementation on iron is visualized to occur by two basic mechanisms. Precipitation may occur through a series of shorted electrochemical cells, whereby cupric ion precipitates on a growing cathodic copper deposit, or deposition may occur via a fluidized cathode of copper particles contacting the ion precipitant.