NIOSHTIC-2 Publications Search

Method for soldering aluminum and magnesium.

Authors
Falke WL; Lee AY; Neumeier LA
Source
US Pat 4,613,069 1986 Sep; :1-6
NIOSHTIC No.
10005490
Abstract
Aluminum, magnesium, or their alloys are soldered by means of a tin- lead system following initial application of a thin coating of nickel-copper alloy. Thus, 1100 aluminum alloy pieces were chemically etched to clean surfaces and then given an electroless zincate treatment to deposit a thin layer of zinc, using cotton swabs to apply the solution. A ni-cu coating then was applied to the surfaces to be soldered by an electrolytic brush-coating method. Five to ten milliliters of an electrolyte containing 125 g/l of nickel acetate, 10 g/l of copper acetate and 5 g/l of boric acid were applied to the metal pieces as cathodes, and the ni-cu coating deposited with the aid of an anode consisting of a 70 pct ni-30 pct cu rod wrapped with a layer of gauze over cotton batting. The process took about 2 min at a current density of 200 ma/cm2 (based on the contact area between the anode stylus and the ni-cu alloy coating). The deposited alloy layer was about 2 microm thick and contained 50-60 pct ni. The alloy coated aluminum pieces then were soldered using conventional techniques with 60 pct pb-40 pct sn solder and a rosin-type flux. The strengths of the joints were similar to joints between copper-copper or brass-brass substrates. The ni-cu alloy layer can also be applied by a conventional electrolytic cell method using the same electrolyte composition as for the brush-plating technique.
Keywords
Metallurgical processes; Metallurgy; Metals; Metal alloys; Soldering
CAS No.
7429-90-5; 7439-95-4
Publication Date
19860923
Document Type
Patent
Fiscal Year
1986
Identifying No.
PA 4,613,069
NIOSH Division
RORC
Source Name
United States Patent 4,613,069
State
MO
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