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Electrochemical study of SiC particle occlusion during nickel electrodeposition.

Authors
Watson-SW
Source
Extended abstracts: American Institute of Chemical Engineers 1992 Annual Meeting, Nov. 1-6, 1992, Miami Beach, Florida. New York: American Institute of Chemical Engineers, 1992 Nov; :1-4
Link
NIOSHTIC No.
10003310
Abstract
Previous work conducted by the USBM showed that chromium particle occlusion occurs as a result of particle collisions with the cathode surface. Conductive chromium particles within the electric field were also shown to cause a local rise in the cathodic current density on the area immediately adjacent to that particle. In order to research the effect of conductive particles versus semi-conductive particles on the occlusion process, nickel electrodeposition was studied in the presence of SiC particles and compared to previous studies on nickel electrodeposition in the presence and absence of Cr particles.
Keywords
Electrochemical-analysis; Electrochemical-properties; Electrochemical-reactions; Metal-compounds; Metal-dusts; Metallic-compounds; Metallic-dusts; Metallic-ions; Mining-industry; Mineral-processing; Metals
Publication Date
19921101
Document Type
Conference/Symposia Proceedings
Fiscal Year
1993
NTIS Accession No.
NTIS Price
Identifying No.
OP 02-93
Source Name
Extended abstracts: American Institute of Chemical Engineers 1992 Annual Meeting, Nov. 1-6, 1992, Miami Beach, Florida
State
NY; FL
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