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Electrochemical study of SiC particle occlusion during nickel electrodeposition.
Extended abstracts: American Institute of Chemical Engineers 1992 Annual Meeting, Nov. 1-6, 1992, Miami Beach, Florida. New York: American Institute of Chemical Engineers, 1992 Nov; :1-4
Previous work conducted by the USBM showed that chromium particle occlusion occurs as a result of particle collisions with the cathode surface. Conductive chromium particles within the electric field were also shown to cause a local rise in the cathodic current density on the area immediately adjacent to that particle. In order to research the effect of conductive particles versus semi-conductive particles on the occlusion process, nickel electrodeposition was studied in the presence of SiC particles and compared to previous studies on nickel electrodeposition in the presence and absence of Cr particles.
Electrochemical-analysis; Electrochemical-properties; Electrochemical-reactions; Metal-compounds; Metal-dusts; Metallic-compounds; Metallic-dusts; Metallic-ions; Mining-industry; Mineral-processing; Metals
Extended abstracts: American Institute of Chemical Engineers 1992 Annual Meeting, Nov. 1-6, 1992, Miami Beach, Florida
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