Risk Assessment and Control of Toxic Gas Releases.
Hazard Assessment and Control Technology in Semiconductor Manufacturing, Lewis Publishers, Inc., Chelsea, Michigan 1989:115-133
The use of risk assessment in the semiconductor industry to evaluate the hazards of toxic gas releases was described. Several toxic gases have been used in the semiconductor industry, including metal hydride gases used in fabrication processes to dope silicon substrates. Anhydrous ammonia (7664417) has been used in reactions with silicon compounds to produce insulating silicon-nitride. Hydrogen-chloride (7647010) and chlorine (7782505) have been commonly used as etching gases. Several regulations have been promulgated by local, state and federal agencies to minimize the risk of extremely hazardous material releases into the environment. Modeling the results of an accidental discharge of extremely hazardous materials (EHM) may be useful as a tool for site planning, emergency preparedness, and emergency response. Two generally accepted release scenarios usually have been considered during the modeling process: instantaneous releases and continuous releases. The dispersion of gases was a function of atmospheric stability, primarily wind and temperature. To examine the level of risk to a neighboring community of a semiconductor facility, dispersion modeling calculations were included for hypothetical releases from a facility that manufactures microwave and optoelectronic devices in San Jose, California. Various engineering controls which can be used to limit the hazards were discussed. The assumptions made when using the dispersion models as presented were noted.
Semiconductors; Electronics-industry; Control-technology; Accident-prevention; Toxic-gases; Safety-research; Explosion-prevention; Hazardous-materials
7664-41-7; 7647-01-0; 7782-50-5
Hazard Assessment and Control Technology in Semiconductor Manufacturing, Lewis Publishers, Inc., Chelsea, Michigan