HHE Report No. HETA-83-164-1377, Siemens Components, Inc., Broomfield, Colorado.
In response to a request from the management of Siemens Components, Inc. (SIC-3674), Broomfield, Colorado, a semiconductor manufacturer, an evaluation was made of possible exposures to acids and organic solvents. Potential chemical exposures include hydrofluoric-acid (7664393), hydrochloric-acid (7647010, 1,1,1-trichloroethane (71556), nitric-acid (7697372), phosphoric-acid (7664382), acetic- acid (64197), sulfuric-acid (7664939), acetone (67641), methanol (67561), and ammonium-hydroxide (1336216) during the polishing and etching stages of the work. In the diffusion step employees risk exposure to hydrogen-peroxide (7722841), ammonium-hydroxide, Freon- 113 (76131), methylene-chloride (75092), nitric-acid, and hydrofluoric-acid. During the application of a photosensitive emulsion to the semiconductor wafer employees risk exposure to n- butyl-acetate (123864), hydrofluoric-acid, xylene (1330207), isopropyl-alcohol (67630), methyl-alcohol (67561), and hydrogen- peroxide. In the etching process exposure to potassium-hydroxide (1310583) and methyl-alcohol is possible. During the tin dip process exposures to Freon-113, methyl-alcohol, and isopropyl- alcohol may occur. No hazardous exposures to organic vapors or acid mists were found. The author concludes that there did not appear to be a health hazard due to overexposure to acid and organic vapors. One area did appear to have a cluster of health complaints; the author recommended that improvements be made in the engineering controls and work habits in this section of the facility. Exhaust ventilation should be installed in the solvent warehouse. Closed containers should be used in transferring degreasing solvents. An evaluation of the exhaust system in the tin dip area is recommended.
Hazard Evaluations and Technical Assistance Branch, NIOSH, U.S. Department of Health and Human Services, Cincinnati, Ohio, Report No. HETA-83-164-1377, 14 pages, 14 references