In-depth survey report: control technology for microelectronics industry at Xerox Corporation, Microelectronics Center, El Segundo, California, report no. CT-115-12b.
An indepth survey of control technology at Xerox Corporation, Microelectronics Center (SIC-3674), El Segundo, California was conducted in November, 1982. The survey was part of an industrywide study of exposures in the microelectronics industry. Engineering controls included general and exhaust ventilation, an automated gas handling system, toxic and combustible gas monitoring systems, drain systems for waste organic solvents, and lucite covers and metal mesh screens across viewing ports to control ultraviolet and radiofrequency emissions. Sampling was conducted for arsenic (7440382), arsine (7784421) diborane (19287457), hydrogen-chloride (7647010), hydrogen-fluoride (7664393), phosphine (7803512), organic solvent vapors, and ultraviolet and radiofrequency emissions. All chemical exposures except for hexamethyldisilizane (999973), for which there is no Federal standard, were below their evaluation criteria. Hexamethyldisilizane concentrations ranged from 74 to 468 micrograms per cubic meter. No excessive exposures to ultraviolet radiation were detected. Significant radiofrequency emissions, 400,000 square Volts per square meter (V2/m2), were detected near a plasma stripper. The threshold limit value is 18,000V2/m2. The authors note that since employees spend no more than 1 or 2 minutes near the plasma stripper, significant radiofrequency exposure from this source is not likely.