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Walk-through survey report: control technology for integrated circuit fabrication at Xerox Corporation, Microelectronics Center, Electronics Division, El Segundo, California.
Mihlan GJ; Ungers LJ; Smith RK; Mitchell RI
Cincinnati, OH: U.S. Department of Health and Human Services, Public Health Service, Centers for Disease Control, National Institute for Occupational Safety and Health, IWS 115-12a., 1983 May; :1-39
A walk through survey was conducted at Xerox Corporation, Microelectronics Center (SIC-3674), in El Segundo, California, on September 1, 1981. The survey was conducted as part of a control technology assessment of the semiconductor manufacturing industry. Engineering controls were assessed within the nine process operations and included thermal oxidation of silicon wafers, low pressure chemical vapor deposition of silicon, photo lithographic processes, plasma etching, wet chemical etching and cleaning, metallization, doping, hydrogen annealing, and testing and packaging. Process operations were representative of metal oxide semiconductor technology. Engineering controls were built into much of the equipment by the manufacturer. Numerous changes were made to the process line since its construction. The authors recommend evaluation of the ventilation system. Engineering controls for the hydrofluoric-acid etching operations, radiofrequency shielding, X- ray shielding, ultraviolet light shielding, and microprocessor controls should be evaluated. The solvent cleaning bench in the furnace area should be relocated. The facility is recommended for detailed study.
NIOSH-Author; NIOSH-Survey; Electronics-industry; Health-protection; Safety-research; Industrial-design; Work-environment; Ventilation; Region-9
Field Studies; Industry Wide
NTIS Accession No.
National Institute for Occupational Safety and Health
Page last reviewed: September 2, 2020
Content source: National Institute for Occupational Safety and Health Education and Information Division