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Industrial hygiene walk-through survey report of Dow Corning Corporation Semiconductor Plant, Hemlock, Michigan.

Authors
Willson RD
Source
Cincinnati, OH: U.S. Department of Health, Education, and Welfare, Public Health Service, Centers for Disease Control, National Institute for Occupational Safety and Health, IWS 68-22, 1978 Oct; :1-19
NIOSHTIC No.
00108660
Abstract
Worker exposures to potentially hazardous physical and chemical agents were determined at the Dow Corning Corporation's semiconductor facility (SIC-3674) in Hemlock, Michigan, on September 6, 1978. The survey was part of a NIOSH health study of newly developing energy technologies. The company had access to an industrial hygiene staff. Signs of leakage of trichlorosilane (10025782) (TCS) were noted at the truck unloading area. Heavy accumulation of a white powder on the ceilings indicated the presence of airborne process materials. The author concludes that the operations at the facility may not be extensive enough to be representative of the photovoltaic cell industry. He recommends an industrial hygiene survey for the TCS unloading area, main production vessel rooms, the cleaning room, and for material recovery processes.
Keywords
NIOSH-Author; NIOSH-Survey; Field-Study; Region-5; Health-surveys; Worker-health; Industrial-hygiene; Workplace-studies; Occupational-health-programs; Industrial-processes; Air-contamination
CAS No.
10025-78-2
Publication Date
19781012
Document Type
Field Studies; Industry Wide
Fiscal Year
1979
NTIS Accession No.
PB82-108275
NTIS Price
A03
Identifying No.
IWS-68-22
NIOSH Division
DSHEFS
SIC Code
3674
Source Name
National Institute for Occupational Safety and Health
State
MI; OH
Performing Organization
PEDCo Environmental, Inc., Cincinnati, Ohio
Page last reviewed: September 2, 2020
Content source: National Institute for Occupational Safety and Health Education and Information Division