Skip directly to search Skip directly to A to Z list Skip directly to page options Skip directly to site content

NIOSHTIC-2 Publications Search

Search Results

Personal fluoride and solvent exposures, and their determinants, in semiconductor manufacturing.

Authors
Woskie-SR; Hammond-SK; Hines-CJ; Hallock-MF; Kenyon-E; Schenker-MB
Source
Appl Occup Environ Hyg 2000 Apr; 15(4):354-361
NIOSHTIC No.
20020864
Abstract
Personal air sampling for fluorides and solvents was done at 35 semiconductor fabrication facilities in the United States. Fluoride compounds were used in etching and cleaning operations, and solvents were used in photoresist and developing operations. All personal solvent and fluoride levels were less than 2 percent of current Occupational Safety and Health Administration (OSHA) standards. Statistical models of the exposure determinants for the target agents found production level, as indicated by number of semiconductor wafer cassettes loaded/unloaded from the target machines or baths, was predictive of fluoride, xylene and 1-methoxy-2-propyl acetate exposures. The percent of fresh air ventilation and the percent of xylene in the photoresist were also significant determinants in the statistical model predicting personal xylene exposure levels.
Keywords
Air-sampling; Fluorides; Solvents; Cleaning-compounds; Statistical-analysis; Models; Air-samples; Xylenes; Exposure-levels; Exposure-assessment; Ventilation; Semiconductors; Chemical-analysis; Glycols; Fluoride-compounds; Exposure-limits; Air-sampling; Air-quality; Air-purification
CODEN
AOEHE9
CAS No.
1330-20-7
Publication Date
20000401
Document Type
Journal Article
Funding Amount
1055222
Funding Type
Cooperative Agreement; Agriculture
Fiscal Year
2000
NTIS Accession No.
NTIS Price
Identifying No.
Cooperative-Agreement-Number-U07-CCU-906162
Issue of Publication
4
ISSN
1047-322X
NIOSH Division
DSHEFS
Source Name
Applied Occupational and Environmental Hygiene
State
OH; MA; CA
Performing Organization
University of California - Davis
TOP