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Electrochemical study of SiC particle occlusion during nickel electrodeposition.

Authors
Watson-SW
Source
J Electrochem Soc 1993 Aug; 140(8):2235-2237
NIOSHTIC No.
10012211
Abstract
Previous, published work conducted by the Bureau of Mines showed that chromium particle occlusion occurs as a result of particle collisions with the cathode surface. Conductive chromium particles within the electric field were also shown to cause a local rise in the cathodic current density on the area immediately adjacent to that particle. In order to research the effect of conductive particles vs. semiconductive particles on the occlusion process, nickel electrodeposition was studied in the presence of SiC particles and compared to previous studies on nickel electrodeposition in the presence and absence of Cr particles. The effect of semiconductive SiC particles on nickel electrodeposition was to catalyze the formation of H as well as Ni+ intermediates.
Keywords
Electrochemical-analysis; Electrochemical-properties; Electrochemical-reactions; Metal-compounds; Metal-dusts; Metallic-compounds; Metallic-dusts; Metallic-ions; Mining-industry; Mineral-processing; Metals; Author Keywords: electrodeposition; electrodeposits; nickel; catalysis; catalysts; particle size; electric impedance; Nyquist diagrams
CODEN
JESOAN
Publication Date
19930801
Document Type
Journal Article
Fiscal Year
1993
NTIS Accession No.
NTIS Price
Identifying No.
OP-228-93
Issue of Publication
8
ISSN
0013-4651
NIOSH Division
ALRC
Source Name
Journal of the Electrochemical Society
State
OR
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