Electrodeposition of Copper.
Schlain-D; McCawley-FX; Smith-GR
U S Pat 4 053 377 1977 Oct; :
An electrorefining or electrowinning method using high current densities and electrolyte flow rates is described. The current densities are approximately 60-400 a/ft2 and the flow rates are 75 ft/min, preferably 150-400 ft/min. This method was used for the refining of blister copper in a bath containing cuso4 and h2so4. The operating temperature was approximately 55 deg c; the c.D. 60- 300 A/ft2; the flowrate 285-400 ft/min; the deposit thickness 194- 502 mils; and the deposition time 16-188 h. The deposits were smooth, of high purity, and thick even at the high current densities used.
U.S. Pat. 4,053,377; Oct. 11, 1977; Chem. Abstr. 85:150,989Y