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Measuring electrodeposit adhesion.

Authors
Cramer-SD; Cammarota-VA Jr.; Schlain-D
Source
Met Finish 1970 Mar; 68:3-8
NIOSHTIC No.
10010108
Abstract
The Bureau of Mines developed a new test for measuring the adhesion of nickel electrodeposits on copper substrates. The proposed test involves brazing the free surface of the deposit to a steel rod with silver solder, machining this specimen to a desired shape, and then measuring the strength of the deposit-substrate bond by the application of a tensile load.
CODEN
MEFIA7
Publication Date
19700301
Document Type
OP; Journal Article
Fiscal Year
1970
NTIS Accession No.
NTIS Price
Identifying No.
OP 35-70
ISSN
0026-0576
NIOSH Division
CPRC
Source Name
Metal Finishing; Preparation, Electroplating, Coating
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