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Grain growth in thin aluminum-4% copper alloy films.

Authors
McBee-WC; McComb-JA
Source
Thin Solid Films 1975 Nov; 30(1):137-143
NIOSHTIC No.
10009890
Abstract
Aluminum-4 wt-pct copper alloy films were prepared by vapor deposition and examined for grain growth in the temperature range 400 deg to 500 deg c. The results show that growth occurs in accordance with the empirical equation d = (kt)n. The term n, with a value of 0.18, Was found to be independent of temperature. A discrete activation energy of 30 kcal/mole was calculated for the process. The observed growth kinetics were compared with those observed for pure bulk aluminum. The observed grain size was independent of film thickness.
CODEN
THSFAP
Publication Date
19751101
Document Type
OP; Journal Article
Fiscal Year
1976
NTIS Accession No.
NTIS Price
Identifying No.
OP 12-76
Issue of Publication
1
ISSN
0040-6090
NIOSH Division
BCEL
Source Name
Thin Solid Films
State
CO; OR
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