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Adhesion of diamond films on tungsten.

Authors
Maggs-KJ; Walkiewicz-JW; Clark-AE
Source
Reno, NV: U.S. Department of the Interior, Bureau of Mines, RI 9590, 1995 Jan; :1-12
Link
NIOSHTIC No.
10005903
Abstract
Diamond films were deposited on tungsten substrates and the effects of deposition parameters on adhesion were determined. The films were produced using a hot filament chemical vapor deposition system. Parameters investigated were substrate temperature and methane concentration in the feed gas. Film quality, morphology, and composition were characterized by scanning electron microscopy, and Raman spectroscopy. Adhesion testing were performed using an indentation technique and the results were quantified by relating adhesion to interface fracture toughness. Diamond films with well-faceted crystalline morphology with grain size greater then 1 micrometers had poor adhesion properties regardless of substrate temperature or methane concentration.
Keywords
Adhesion-tests; Deposition; Coatings; Toughness; Morphology; Adhesions; Diamonds; Films; Tungsten
Publication Date
19950101
Document Type
Report of Investigations
Fiscal Year
1995
NTIS Accession No.
PB96-136437
NTIS Price
A03
Identifying No.
RI-9590
NIOSH Division
RERC
Source Name
Reno, NV: U.S. Department of the Interior, Bureau of Mines, RI 9590
State
NV
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