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Walk-Through Survey Report: Control Technology For Integrated Circuit Fabrication At Xerox Corporation, Microelectronics Center, Electronics Division, El Segundo, California, Report No. IWS-115-12a.

Authors
Mihlan-GJ; Ungers-LJ; Smith-RK; Mitchell-RI
Source
NIOSH 1983 May:39 pages
Link
NIOSHTIC No.
00134397
Abstract
A walk through survey was conducted at Xerox Corporation, Microelectronics Center (SIC-3674), in El Segundo, California, on September 1, 1981. The survey was conducted as part of a control technology assessment of the semiconductor manufacturing industry. Engineering controls were assessed within the nine process operations and included thermal oxidation of silicon wafers, low pressure chemical vapor deposition of silicon, photo lithographic processes, plasma etching, wet chemical etching and cleaning, metallization, doping, hydrogen annealing, and testing and packaging. Process operations were representative of metal oxide semiconductor technology. Engineering controls were built into much of the equipment by the manufacturer. Numerous changes were made to the process line since its construction. The authors recommend evaluation of the ventilation system. Engineering controls for the hydrofluoric-acid etching operations, radiofrequency shielding, X- ray shielding, ultraviolet light shielding, and microprocessor controls should be evaluated. The solvent cleaning bench in the furnace area should be relocated. The facility is recommended for detailed study.
Keywords
NIOSH-Author; NIOSH-Survey; Electronics-industry; Health-protection; Safety-research; Industrial-design; Work-environment; Ventilation; IWS-115-12a; Region-9;
Publication Date
19830531
Fiscal Year
1983
NTIS Accession No.
PB83-239053
NTIS Price
A04
Identifying No.
IWS-115-12a
NIOSH Division
DPSE;
SIC Code
3674;
Source Name
Division of Physical Sciences and Engineering, NIOSH, Cincinnati, Ohio, Report No. IWS-115-12a, 39 pages, 2 references
State
CA; OH;
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